Expertise

DIP Assembly

Through-hole component insertion, soldering, inspection, rework and final assembly for PCBA production.

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UT / POWER ELECTRONICS

DIP Assembly as part of a connected development and production system.

Through-hole component insertion, soldering, inspection, rework and final assembly for PCBA production.

Scope

What this expertise covers.

01

Component insertion

Dual in-line and through-hole components are inserted into pre-drilled PCB holes.

02

Soldering

The source describes wave soldering and hand soldering for securing component pins.

03

Inspection and testing

Visual and automated inspection checks solder joints, bridges and component placement.

04

Rework and repair

Soldering defects and faulty components are corrected before final assembly.

05

Final assembly and packaging

Boards proceed through later assembly, protection and packaging stages after inspection.

DIP Assembly environment

Connected delivery

Designed to support the wider project path.

Use the contact channel to connect this capability to a product model, prototype or production requirement.

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