Expertise

Engineering
through production.

Research, software and hardware design, SMT assembly, DIP assembly, testing, repair and project planning.

Six expertise areasFrom R&D to project planningA connected engineering and production workflow.

UT / POWER ELECTRONICS

One workflow from product requirement to production execution.

Capability pages use only scope supported by the archived company materials.

Research and Development environment
01

Research and Development

R&D services for PCBA production, including design, prototyping, process development, testing, validation and customer collaboration.

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Software and Hardware Design environment
02

Software and Hardware Design

The official website lists software and hardware design as a service. Detailed source-page copy contains unrelated template text and is therefore not republished.

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SMT Assembly environment
03

SMT Assembly

Surface-mount assembly workflow from PCB design and solder-paste printing through component placement, reflow, inspection, testing and rework.

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DIP Assembly environment
04

DIP Assembly

Through-hole component insertion, soldering, inspection, rework and final assembly for PCBA production.

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Testing and Repairing environment
05

Testing and Repairing

Testing and repair services intended to verify PCBA functionality, identify defects and confirm repairs.

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Project Planning environment
06

Project Planning

Planning for PCBA projects across scope, design, resources, scheduling, procurement, production, quality and communication.

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Production context

Engineering decisions meet factory execution.

Design, assembly and testing are shown in the environments where the work takes place.

United Technology production line

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